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HOME > PRODUCT > ¿þÀÌÇÁ&¾àÇ°·ù
STRIPPER / Photo Resist Stripper
 
 

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¢¹¹ÝµµÃ¼ °øÁ¤ Áß PR(Photo Resist)ÀÇ Strip °øÁ¤¿¡ »ç¿ëµÇ´Â ¼öÁö¿ëÇØÁ¦ÀÔ´Ï´Ù.

¢¹Etching ÈÄ Ç¥¸éÁ¶µµ¸¦ º¯È­½ÃÅ°Áö ¾Ê°í PR¸·À» Á¦°ÅÇÏ¿© AlÀü±Ø¸·ÀÇ ÆÐÅÏÀ» Çü¼º½ÃÅ°´Â ±â´ÉÀÌ ¶Ù¾î³³´Ï´Ù.

¢¹ÇÒ·Î°Õ ¿ëÁ¦¿Í °°ÀÌ È¯°æ¹®Á¦¸¦ ÀÏÀ¸Å°Áö ¾Æ´ÏÇÏ¸ç ¼öÁö Á¦°Å ½Ã ¶Ù¾î³­ ¿ëÇرâ´ÉÀ» ³ªÅ¸³À´Ï´Ù.

¢¹Æ¯È÷ ¼öÁö¿ëÇØ ÈÄÀÇ ¼ö¼¼ °øÁ¤ ½Ã¿¡ ÀÜ»çºÐÀÇ ¼¼Á¤·ÂÀÌ ¶Ù¾î³¯ »Ó¸¸ ¾Æ´Ï¶ó Ÿ ¿ëÁ¦¿¡ ºñÇØ 2 ~ 3¹è ÀÌ»óÀÇ ¼¼Á¤È¿À²À» ³ôÀÏ ¼ö ÀÖ½À´Ï´Ù.
¢¹PR Á¦°Å ÈÄ ÀÜ»çºÐÀÌ ³²Áö ¾ÊÀ¸¸ç, ¼ö¼¼ ½Ã wetting¼ºÀÌ ¶Ù¾î³³´Ï´Ù.

¢¹¼ÒÀÚ(Si wafer, GaAs wafer, Sodalime glass µî)¿¡ ¼Õ»óÀÌ ¾ø½À´Ï´Ù.

¢¹Metal ÁõÂøÃþ(Ni, Au, Al, Ti, ITO, Cr)¿¡ ¼Õ»óÀÌ ¾ø½À´Ï´Ù.

¢¹Positive ¹× negative type PR ¸ðµÎ Á¦°Å °¡´ÉÇÕ´Ï´Ù.

¢¹Lift off¿ë PR Stripper·Îµµ »ç¿ëÀÌ °¡´ÉÇÕ´Ï´Ù.

 

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JY-016-01 ST–1026 ¹ÝµµÃ¼ °øÁ¤ Áß PR(Photo Resist)ÀÇ Strip °øÁ¤¿¡ »ç¿ëµÇ´Â ¼öÁö¿ëÇØÁ¦ °ßÀû ¹®ÀÇ
TRANSENE / Etchant
 
 
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¢¹Copper Etchant 49-1Àº °í¼øµµÀÇ Á¦Ç°À¸·Î Cu, GaAsÀÇ Etching¿¡ »ç¿ëµÇ´Â Á¦Ç°ÀÔ´Ï´Ù.
¢¹Lead free technology¿¡ ´ëÀÀÇϱâ À§ÇÏ¿© 100% tin°ú tin 97%-Silver 3%ÀÇ Solder¿¡ ´ëÇÏ¿©
   AttackÇÏÁö ¾Ê½À´Ï´Ù. 
¢¹Gold, Nickel, Nickel-Vanadium alloys¿¡ ´ëÇؼ­µµ ¶Ù¾î³­ Selectivity¸¦ °¡Áö°í ÀÖ½À´Ï´Ù.



   
TS-4404-11 49-1 Cu Etchant, Æ÷Àå´ÜÀ§£º1Ga/bt, Maker£ºTransene °ßÀû¹®ÀÇ
TS-4404-21 TFB Ni Etchant, Æ÷Àå´ÜÀ§£º1Ga/bt, Maker£ºTransene °ßÀû¹®ÀÇ
TS-4404-22 TFA Au Etchant, Æ÷Àå´ÜÀ§£º1Ga/bt, Maker£ºTransene °ßÀû ¹®ÀÇ
UV Imprint Resin
 
 

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¢¹​MINS-ERM

¼ö¹é ³ª³ë¹ÌÅÍ¿¡¼­ ¼ö½Ê ¸¶ÀÌÅ©·Î¹ÌÅÍ ¼öÁØÀÇ ¹Ì¼¼ ÆÐÅÏÀÇ ¿ª»óÀ» Á¦ÀÛÇϰųª patternÀÇ ¼öÃà,º¯Çü ¾øÀÌ Àڱ⺹Á¦¸¦ ¼öÇàÇϱ⿡ ÀûÇÕÇÏ´Ù. Ç¥¸é¿¡³ÊÁö°¡ ¸Å¿ì ³·Àº Ư¼ºÀÌ ÀÖÀ¸¸ç ÀÌÇüÀÌ ¾î·Á¿î Ç¥¸é¿¡¼­µµ ½±°Ô ÀÌÇüÀÌ °¡´ÉÇÏ¿© 1ȸ¼º Çü¶ß±â Àç·á·Î ÁÖ·Î ÀÌ¿ëµÈ´Ù. UVA ÆÄÀå´ë¿¡¼­ °æÈ­µÇ´Â UV °æÈ­¼º Àç·áÀÌ´Ù.

¢¹​MINS-311RM

UV imprint¿ë stamp Á¦Á¶ ¿ø·á, Àڱ⠺¹Á¦°¡ °¡´ÉÇÏ°í UV imprint °øÁ¤½Ã ¿øÈ°ÇÑ ÀÌÇü¼º ¹× ÆÐÅÏ Àü»ç¼ºÀ» º¸ÀδÙ. ¼ö½Ê ¸¶ÀÌÅ©·Î¹ÌÅÍ ÀÌÇÏÀÇ ÆÐÅϳôÀÌ¿¡¼­ ¾ÈÁ¤ÀûÀÎ ¼º´ÉÀ» ³ªÅ¸³½´Ù. UVA ÆÄÀå´ë¿¡¼­ °æÈ­µÇ´Â UV °æÈ­¼º Àç·áÀÌ´Ù.

 

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LM1-001E MINS-ERM MINS-ERM 1kg °ßÀû ¹®ÀÇ
LM2-0023 MINS-311RM MINS-311RM 1kg °ßÀû ¹®ÀÇ
WAFER / EPI Wafer
 
 

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- Substrate
¢¹Size :
¢¹Type :
¢¹Resistivity :
¢¹Thickness :
¢¹Flat zone direction & size :
¢¹Back side seal :
- Epi
¢¹Type :
¢¹Thickness :
¢¹Resistivity :  

 

   
LW-5000-11 - 6inch, - Sub layer£ºN(As), (100), 625¡¾25§­, 0.001¡­0.005§Ùcm, - Epi layer£ºN(P), 0.7§Ùcm, 8um °ßÀû ¹®ÀÇ
LW-5000-12 - 6inch, -Sub layer£ºN(As), (100), 625¡¾25§­, 0.0001¡­0.007§Ùcm, -Epi layer£ºN(P), 0.3§Ùcm, 7um °ßÀû ¹®ÀÇ
WAFER / Glass Substrate
 
 

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¢¹Sodalime, Pyrex, Borosilicate, E-2000 µî, ´Ù¾çÇÑ Á¾·ùÀÇ Glass WaferÀÇ Àç°íÈ®º¸ ¹× °¡°ø ¼­ºñ½º¸¦ ÇÕ´Ï´Ù.


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¢¹´Ù¸¥ »ç¾çÀÇ Á¦Ç°µµ °¡´ÉÇÕ´Ï´Ù.

   
LW-4100-01 SODALIME ÀçÁú£ºSodalime Glass, ¹«¿¬¸¶, Å©±â£º100¡¿100(¡¾0.2mm), µÎ²²£º700¡¾50§­ °ßÀû ¹®ÀÇ
LW-4100-02 SODALIME ÀçÁú£ºSodalime Glass, ¹«¿¬¸¶ , Å©±â£º100¡¿100(¡¾0.2mm), µÎ²²£º1100¡¾50§­ °ßÀû ¹®ÀÇ
LW-133-01 BORO33 ÀçÁú£ºBoro33 Glass °ßÀû ¹®ÀÇ
LW-242-01 EAGLE-XG ÀçÁú£ºEagle XG Glass °ßÀû ¹®ÀÇ
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