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LIGHTING SIGHT GLASS
 
 

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ÀçÁú : º»Ã¼(ÇÁ·¹ÀÓ ÇÏ) / SUS316L, Ä¿¹ö(ÇÁ·¹ÀÓ »ó)º¼Æ®¿Í¼Å / SUS304, ÆòÆÐÅ· / ½Ç¸®ÄÜ°í¹«, â / ³»¿­°­È­À¯¸®
¢¹LED¶óÀÌÆ® Àü¿ø : AA°ÇÀüÁö 1°³(Å×½ºÆ®¿ë ºÎ¼Ó)
¢¹³»¾Ð°­µµ : 1.5S ~ 3S / 0.18MPa, 4S / 0.16MPa
  

   
LA3-141-01 NMB-LC-1.5S Æä·² »çÀÌÁî : 1.5S / »çÀÌÁî (§®) : ¥Õ64 x 134 °ßÀû ¹®ÀÇ
LA3-141-02 NMB-LC-2S Æä·² »çÀÌÁî : 2S / »çÀÌÁî (§®) : ¥Õ75 x 134 °ßÀû ¹®ÀÇ
LA3-141-03 NMB-LC-3S Æä·² »çÀÌÁî : 3S / »çÀÌÁî (§®) : ¥Õ100 x 134 °ßÀû ¹®ÀÇ
LA3-141-04 NMB-LC-4S Æä·² »çÀÌÁî : 4S / »çÀÌÁî (§®) : ¥Õ128 x 134 °ßÀû ¹®ÀÇ
LA3-141-05 NMB-LA-1.5S Æä·² »çÀÌÁî : 1.5S / »çÀÌÁî (§®) : ¥Õ62 x 127 °ßÀû ¹®ÀÇ
LA3-141-06 NMB-LA-2S Æä·² »çÀÌÁî : 2S / »çÀÌÁî (§®) : ¥Õ75 x 127 °ßÀû ¹®ÀÇ
LA3-141-07 NMB-LA-3S Æä·² »çÀÌÁî : 3S / »çÀÌÁî (§®) : ¥Õ100 x 127 °ßÀû ¹®ÀÇ
LA3-141-08 NMB-LA-4S Æä·² »çÀÌÁî : 4S / »çÀÌÁî (§®) : ¥Õ128 x 127 °ßÀû ¹®ÀÇ
LIQUID SCALE(IMHOFF CONE) GLASS
 
 

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LA3-7082-01 1055 »ç¾ç£ºº»Ã¼/ ¿ë·®(§¢)£º1000 °ßÀû ¹®ÀÇ
LA3-7082-11 1056 »ç¾ç£ºÀü¿ë ½ºÅÄµå °ßÀû ¹®ÀÇ
LOCK CONTAINER WITH HANDLE PP
 
 

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¢¹ÀçÁú : º»Ã¼¡¤¶Ñ²± / PP(Æú¸®ÇÁ·ÎÇÊ·»), ÆÐÅ· / ½Ç¸®ÄÜ
¢¹³»Ä¡¼ö : 170 x 138 x98mm
¢¹³»¿­¿Âµµ : º»Ã¼¡¤¶Ñ²± / -20~+120¡É, ÆÐÅ· / -30 ~ +200¡É
¢¹°¡Á¤¿ë ÀüÀÚ·¹ÀÎÁö, ³Ãµ¿°í, ½Ä±â¼¼Ã´±â ÀÌ¿ë °¡´É
 


 

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LA3-9781-01 HPL973 ¿ë·® (§¢): 950 / ¿ÜÄ¡¼ö (§®): 180 x 148 x 108 °ßÀû ¹®ÀÇ
LOGITECH / Calcined Al2O3 Powders
 
 

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¢¹Ideal for hard material such as ceramics, silicon and hardened steel

¢¹Available in a range of micron sizes from 1 to 50

 

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¢¹Æ÷Àå´ÜÀ§ : 5kg pack size 

   
LT-4001-01 OCON-007 Calcined Aluminium Oxide Powder, ÀÔµµ£º1§­, ¿ëµµ£º°íÁ¤¹Ð Polishing and ÃÖÈÄ ´Ü°è Polishing °ßÀû ¹®ÀÇ
LT-4001-02 OCON-008 Calcined Aluminium Oxide Powder, ÀÔµµ£º3§­, ¿ëµµ£º°¡Àå ÀϹÝÀûÀÎ ÀÔµµ·Î ±¤¹üÀ§ÇÑ ·¦ÇÎÀÛ¾÷ °ßÀû ¹®ÀÇ
LT-4001-01 OCON-009 Calcined Aluminium Oxide Powder, ÀÔµµ£º9§­, ¿ëµµ£ºDelicate materialsÀÇ ºü¸¥ Stock Á¦°Å °ßÀû ¹®ÀÇ
LOGITECH / Lapping Plate
 
 

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¢¹A system for semiconductor wafers and devices would typically include follows

 1. Wafer-support disc bonding of low, medium or high precision

2. Jig controlled lapping and polishing using automated single, single or multi-workstation  machines.

3. Mild Chemical Mechanical Processing (CMP) or aggressive chemical etch polishing within a controlled environment​.

¢¹PM5 systems are typically used in the processing of: Silicon, Gallium Arsenide, Cadmium Zinc Telluride, Indium Phosphide, Mercury Cadmium Telluride, Cadmium Sulphide.

 

   
LT-1021-01 1PLC1-0100 Ç÷¹ÀÌÆ® ÀçÁú£ºCast Iron, Å©±â£º300mm, Groove£ºAnnular, Àû¿ë ½Ã½ºÅÛ£ºPM5, PP5 or PLJ2 Jig °ßÀû ¹®ÀÇ
LT-1021-02 1PLC1-0300 Ç÷¹ÀÌÆ® ÀçÁú£ºCast Iron, Å©±â£º300mm, Groove£ºRadial, Àû¿ë ½Ã½ºÅÛ£ºPM5, PP5 or PLJ2 Jig °ßÀû ¹®ÀÇ
LT-1021-03 1PLC1-0900 Ç÷¹ÀÌÆ® ÀçÁú£ºCast Iron, Å©±â£º300mm, Groove£ºNo Groove, Àû¿ë ½Ã½ºÅÛ£ºPM5, PP5 or PLJ2 Jig °ßÀû ¹®ÀÇ
LT-1022-01 1PLG1-0100 Ç÷¹ÀÌÆ® ÀçÁú£ºGlass, Å©±â£º300mm, Groove£ºNo Groove, Àû¿ë ½Ã½ºÅÛ£ºPM5, PP5 or PLJ2 Jig °ßÀû ¹®ÀÇ
LT-1022-02 1PLG1-0300 Ç÷¹ÀÌÆ® ÀçÁú£ºGlass, Å©±â£º300mm, Groove£ºRadial, Àû¿ë ½Ã½ºÅÛ£ºPM5, PP5 or PLJ2 Jig °ßÀû ¹®ÀÇ
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