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WAFER / Thermal Oxidation Wafer



◆사양 ▷Diameter : 4＂∼ 8＂ ▷Dopant : P type or N type ▷Crystal Orientation : ＜100＞,＜111＞ ▷Thickness : ▷Resistivity : ▷Wet Thermal Oxide Thickness : 3000Å∼20000Å(2㎛) ※ 다른 사양의 서비스도 가능합니다.

LW-100-01

크기：4＂ 타입：P형, 방향：＜100＞, 두께：1000±25㎛, 저항：1∼20Ω.㎝, Oxide 두께：1㎛(10,000Å)

견적 문의

LW-100-02

크기：4＂ 타입：P형, 방향：＜100＞, 두께：525±25㎛, 저항：1∼30Ω.㎝, Oxide 두께：0.5㎛

견적 문의

LW-100-03

크기：4＂ 타입：P형, 방향：＜100＞, 두께：525±25㎛, 저항：1∼20Ω.㎝, Oxide 두께：0.3㎛

견적 문의

WAFER / Undoped Silicon Wafer



◆사양 ▷Single Side Polishing (SSP) ▷Notch type ▷Type/Dopand : P/Undoped ▷Crystal Orientation : <100> ▷Resistivity : >10,000Ω-㎝

LUW-800-01

구경:8인치, Type:P, 방향:＜100＞, 두께:680~710㎛, 저항:>10,000Ωcm, SSP, Notch

370,000(VAT별도)

ZEON / E-Beam Lithography Resist



◆특징 ▷High resolution (sub-10-nm) ▷Excellent etch resistance – dry and wet etch ▷High sensitivity ▷Strong adhesion to most substrates ▷Thermal stability ▷High contrast ▷High aspect ratio ▷Processing stability ▷No post exposure bake ▷Shipping and storage at room temperature ▷Post coat delay ▷Post exposure delay