◆특징
▷Solvent for dilution of photoresist
▷Suitable for dilution of photoresist and washing of wafers and coater-cup.
▷In casebof non-bake, it  is possible to use as Remover.

◆사양
▷포장단위 : 4L/bottle

◆사양 

◆사양​

AZ® Remover 920 is designed for fast delamination and dissolution of photoresist patterns while maintaining broad compatibility with device substrates and metal films.

Merck’s proprietary solvent and additive blend is environmentally friendly and fully compliant with the European Union’s REACH regulatory code. Compatible with most AZ® positive resists (complete dissolution) and most AZ® negative resists (dissolution or delamination depending on degree of cross-linking). 

Product Properties

• Flashpoint: 84.4°C
• Viscosity (20°C): 1.84 cSt
• Boiling point: 188°C
• Density (at 25°C): 1.084 g/cm3

Compatibility

• Metals: no attack on Al, Cu, Ti, W, TiW, TiN, Sn, Ni
• Substrates: Si, SiO2, GaAs

Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details.

Main Features

• Fast delamination of photoresist patterns
• Broad compatibility
• Environmentally friendly

Some Applications

• Bulk Photoresist Removal
• Metal Lift-off Lithography
• Cu Pillar Metallization Cleans
• RDL Metallization Cleans
• Delamination of Heavily Cured Photoresist Patterns & Organic Residues

​